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Junction Box Bonding

These 1.1mm and 1.5mm thick tapes are tailored specifically for the bonding of PV junction boxes to a variety of backsheet substrates.  Die-cut preforms can be quickly designed and tailor made for your junction box footprint and, when used as an alternative to a silicone-based adhesive, these homogenous foamed tapes provide an instant bond which reduces the module "down-time" typically due to waiting for initial curing and tack-free times.

Please download the 1.1mm thick tape data sheet from the right-hand side of this page or from within our Downloadssection.

Please download the 1.5mm thick tape data sheet from the right-hand side of this page or from within our Downloadssection.

  • 1.1mm and 1.5mm thicknesses available 
  • Acrylic Foam carrier
  • Acrylic Foam adhesive
  • Red Siliconised PE film or paper release liner
  • Short-term temperature resistance 160C
  • Long-term temperature resistance 100C
  • Low temperature resistance -40C
  • Very good UV resistance
Junction Box Bonding